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  • Scholarships

    HKSAR Government Talent Development Scholarship (TDS) 2023-24 (Deadline: 15 January 2024)

    17 NOV 2023 - 15 JAN 2024
    HKSAR Government Talent Development Scholarship (TDS) 2023-24 (Deadline: 15 January 2024)

    In order to encourage students to develop their talents in other areas in addition to their academic study, the Talent Development Scholarship (TDS) was established by the Hong Kong Special Administrative Region (HKSAR) Government to give recognition to students who have demonstrated achievement or talent in non-academic areas and provide support for them to further develop their talent and potential. For 2023-24, up to 100 TDS awards at HK$10,000 each will be awarded to current full-time local and non-local publicly-funded degree or above level students studying in any discipline, but exclude exchange students not studying a full degree or above programme in Hong 
    Kong. The scholarship is now open for application, please click here for more details. 

     

  • Scholarships

    AIA Scholarships 2023-24 (Deadline: 21 January 2024)

    15 NOV 2023 - 21 JAN 2024
    AIA Scholarships 2023-24 (Deadline: 21 January 2024)

    AIA Foundtaion established the AIA Scholarships in 2020 and has pledged US$100 million to support 100 undergraduates every year to pursue studies at universities in Hong Kong over the next few decades. For the academic year 2023-24, 7 awards of HK$50,000 each per annum, renewable for each academic year to support the full course of undergraduate study, will be available for local full-time Year 1 undergraduate students who are enrolled in UGC-funded first degree programmes at HKBU immediately succeeding completion of their senior secondary school education. Up to 14 eligible candidates will be nominated for the final selection by AIA Foundation.

     

    The scholarship is now open for application, please click here for more details.

  • Scholarships

    HKBU Alumni Gratitude Scholarship (AGS) 2023-24 (Deadline: 28 January 2024)

    15 NOV 2023 - 28 JAN 2024
    HKBU Alumni Gratitude Scholarship (AGS) 2023-24 (Deadline: 28 January 2024)

    The Scholarship was set up with donations raised by the Village CARE Campaign. A group of HKBU alumni pledged a sum donation in support of students with special educational needs (SSEN). The Scholarship represents a way to show the alumni’s gratitude to their alma mater, an encouragement for the next generation of students to thrive in their own way.

     

    For the 2023-24 academic year, up to 10 AGS of HK$15,000 each will be available to recognize the SSEN in pursuit of excellence in academic, non-academic merits and improvement in academic performance. The scholarship is now open for application, please click here for more details.

  • Scholarships

    HSBC Hong Kong Scholarship 2023-24 (Deadline: 26 January 2024)

    14 NOV 2023 - 26 JAN 2024
    HSBC Hong Kong Scholarship 2023-24 (Deadline: 26 January 2024)

    HSBC has a long history of supporting educational activities and nurturing young people for the betterment of the community. For the 2023-24 academic year, HSBC is offering HSBC Hong Kong Scholarship, at HK$50,000 each, to six HKBU local full-time undergraduate students. Up to nine eligible candidates will be nominated for the final selection by HSBC.  

     

    The scholarship is now open for application, please click here for more details.

  • Scholarships

    HKSAR Endeavour Merit Award (EMA) 2023-24 (Deadline: 28 January 2024)

    14 NOV 2023 - 28 JAN 2024
    HKSAR Endeavour Merit Award (EMA) 2023-24 (Deadline: 28 January 2024)

    The Hong Kong Special Administrative Region (HKSAR) Government has established the Endeavour Merit Award (EMA) to give recognition to deserving post-secondary students with special educational needs (SSEN) in the pursuit of excellence in academic and other areas.

     

    For the 2023-24 academic year, up to 10 EMA of HK$15,000 each will be available for eligible HKBU students. The scholarship is now open for application, please click here for more details.