Seeding's “VIE” Virtual Internship Programme

Seeding's “VIE” Virtual Internship Programme

Choice of companies: different companies in Dublin, Beijing, Shanghai, Tokyo, Taipei, HK, Singapore, etc.
Application: https://forms.gle/B6GnLtsqC9ahBpB76

Details:  https://drive.google.com/file/d/1IHWvaIbg3ZltbqBIBJylSzytT1p_kNNG/view?usp=sharing
Application deadline: 2 Oct 2021

[HKBU will provide a lump sum of HK$1,900 subsidy to each participating student (*applicable to UGC funded undergraduates only) after the completion of internship with satisfactory performance. All the quotas will be filled on a first-come first-served basis.]