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  • Career

    Societe Generale Hong Kong FinHACK 2019

    28 - 30 JUN 2019
    Societe Generale Hong Kong FinHACK 2019

    Societe Generale FinHack is back for the third time this year! Societe Generale and WHub will be jointly hosting this year's FinHACK on 28-30 June 2019, a 36-hour hackathon inviting innovative minds to build the future of tomorrow. It is one of SG's key initiatives we organize in Hong Kong to cultivate open innovation and connect with the digital community consisting of the university students, entrepreneurs, coders, developers and so on.

    During the challenge participants will have 36 hours to design and develop innovative solutions to address business challenges spanning the themes of Cybersecurities, Green Finance and Digital Banking. Winners will have the possibility to further develop and implement their ideas into real solutions.

    FinHACK 2019 is open to all university students, entrepreneurs, coders and developers. With the support of industry experts and representatives from Societe Generale, participants will have 36 hours to design and develop innovative solutions to address business challenges spanning the themes of Cybersecurities, Green Finance and Digital Banking. Winners will have the possibility to further develop and implement their ideas into real solutions.

    In line with its commitment to anticipate the fast-changing customer demand, Societe Generale is developing its innovation strategy by experimenting with disruptive technologies and stepping up its interaction with the digital ecosystem in a spirit of open cooperation.

    Read more on Societe Generale and Innovation on https://www.societegenerale.com/en/digital-and-innovation 

    To register and for any general enquiries, please visit: http://finhack.io

  • Career

    E-blast for students: New Internships in New York, London & Berlin + Advertising Agency Internship Contest

    26 JUN - 10 JUL 2019
    E-blast for students: New Internships in New York, London & Berlin + Advertising Agency Internship Contest

    NEW INTERNSHIPS IN NYC, LONDON & BERLIN!

    Opportunities in Fashion Design, Filmmaking, Production, Post Production & Graphic Design. We are currently accepting participants for Spring & Summer 2020. 

    ADVERTISING AGENCY INTERNSHIP CONTEST

    WIN AN INTERNSHIP AT MCCANN OR TBWA\ HONG KONG 
    + A $1500 SCHOLARSHIP FOR THE ARTBOUND INITIATIVE PROGRAM

    CONTEST TERMS: 
    - Must be a Graphic Design, UI/UX Design or Marketing major 
    - Must submit your application by July 10, 2019: instructions and application form here
    - Must be a currently enrolled student or recent graduate from less than 12 months
    - Must be available during for 3 months from November 2019

    HOW DOES IT WORK? 
    1. Submit your application by July 10, 2019 
    2. ArtBound Initiative will select 10 finalists 
    3. McCann & TBWA\ will make their selection
    4. Get selected, receive the scholarship and spend your time in Hong Kong interning for the best ad agencies worldwide!

    START YOUR APPLICATION HERE

    SEE HUGH'S INTERNSHIP AT TBWA\ HONG KONG: 

    ArtBound Initiative connects students and recent graduates with key players in the creative industry in New York, London, Berlin and Hong Kong. With a network of over 150 companies, artists and designers, we offer customized internships for our participants to launch their career.

    Want more info? Schedule a call with an advisor or email us here.

  • Career

    2019 Deloitte Digital Difference Camp

    18 JUN - 05 JUL 2019
    2019 Deloitte Digital Difference Camp

    2019 Deloitte Digital Difference Camp
    Location: Shanghai
    Application deadline: 5 July 2019
    Application: Please refer to the QR code in the poster.

  • Career

    Hang Seng Bank- Half Day Company Visit - GO! HASE

    05 JUN 2019
    Hang Seng Bank- Half Day Company Visit - GO! HASE

    Hang Seng Bank- Half Day Company Visit - GO! HASE
    Date: 5 June 2019 (Wed)
    Time: 15:00 –18:00
    Venue: 24/F, Hang Seng Headquarter, 83 Des Voeux Road, Central

    Note: RSVP is required. Students who are interested, please submit registration to tao.application@hangseng.com (via email) with the subject title ‘”Registration – GO! HASE Half Day Company Visit” including the following information:
    1) Full Name
    2) Contact number and email
    3) University, major and year of study

    Registration Deadline: 17th May 2019 (Friday)

  • Career

    Blockchain Career Pathway Sharing

    01 JUN 2019
    Blockchain Career Pathway Sharing

    Blockchain Career Fair Sharing 區塊鏈與新世代職業機遇分享會
    Click here to view this email in your browser.

    Blockchain 區塊鏈技術被稱為 Web 3.0、繼社交網路後新一波巨型典範轉移。若 AI 人工智能是接下來十年將全面改寫企業資料收集與決策、不可忽視的巨浪,那區塊鏈技術帶起的分散式交易

    網路、去中心化信任體系等新平台,則是現行金融、社會體系將面臨的最大挑戰者,新品種科技巨人幾乎必定會從中誕生。對於創業者或是新一代青年來說,沒有比現在搭上人工智能、區塊鏈技術巨浪更好的創業契機。是次分享嘉賓將重點分享有關區塊鏈技術的行業最發展,講述職業發展新機遇。

    Please click HERE for details and registration!